implementation of a switch-assisted, mechanically compact 4-port transceiver module, with each port capable of delivering 20W continuous-wave output power. The design employed high-performance RF switches to enable dynamic selection between transmit and receive chains, ensuring clear and reliable isolation between Tx and Rx paths.

The study evaluated multiple architecture configurations to balance performance, flexibility, and cost, while ensuring minimal crosstalk and high linearity across all channels. Detailed RF budget analyses were conducted, examining gain, noise figure, P1dB, and port-to-port isolation to ensure the system would meet the stringent requirements of advanced wireless communication and radar applications.

Thermal management formed a critical part of the study, with simulations and preliminary designs incorporating integrated heatsinking and innovative cooling strategies to maintain stability at high output power. Mechanical design focused on achieving a compact, rugged form factor, optimised for space-limited platforms without compromising RF performance. The study concluded with recommendations on component selection, modular layout, and scalable manufacturing approaches to enable cost-effective production and reliable operation in real-world deployments.

A customised solid-state power amplifier (SSPA) solution engineered for ISM band applications, designed to deliver 30W continuous-wave (CW) output power with 40 dB small-signal gain, all housed in a mechanically compact and robust form factor. The design targeted specialised wireless applications where size, efficiency, and reliability were critical requirements.

The amplifier architecture employed high-efficiency GaN devices, complemented by broadband input and output matching networks to ensure stable operation across the entire ISM band. Careful attention was given to achieving excellent linearity, low intermodulation distortion, and high power-added efficiency to meet regulatory and performance standards.

Thermal management formed a key part of the design, integrating advanced heatsinking and thermal interface materials to maintain temperature stability under high-duty-cycle operation. Mechanical design efforts focused on minimising volume and weight while ensuring structural integrity, ease of integration, and resistance to vibration and environmental stress.

The project also addressed manufacturability and scalability, offering recommendations on component sourcing, PCB design, and modular construction to support potential production for both industrial and commercial deployments.

Band, specifically optimised for mobile Bluetooth and short-range wireless communication applications. Developed as part of a new startup’s innovation efforts, the design aimed to address the growing need for compact, versatile antennas capable of maintaining robust connectivity across dynamic operating conditions.

The antenna employed a controlled RLC network integrated within the matching circuitry to achieve precise tuneability across the ISM band. This allowed the system to dynamically adjust impedance characteristics, ensuring optimal matching, minimised return loss, and consistent radiation efficiency as device conditions and surroundings changed. The tuneable design supported enhanced link reliability, reduced power consumption, and improved coexistence with other wireless technologies in congested environments.

Mechanical design considerations focused on achieving a compact, low-profile form factor suitable for integration into handheld or portable devices without compromising performance. The project also involved extensive simulation and prototyping to validate broadband operation, radiation patterns, and efficiency under real-world conditions, laying the groundwork for scalable manufacturing and commercial deployment.

Solutions for an Ericsson BTS transceiver system operating around the L band, designed to support WCDMA modulation schemes for high-capacity mobile networks. The system architecture was engineered to provide 500W continuous wave (CW) output power, accommodating a peak-to-average power ratio (PAPR) of 10, as required for WCDMA’s complex modulation and high dynamic range demands.

The final stage power amplifier, based on high-efficiency GaN technology, achieved a notable 55% power-added efficiency at rated output, balancing high power delivery with thermal and energy efficiency requirements. The RF budget analysis involved detailed gain distribution, noise figure optimisation, linearity assessment (including ACPR and IMD performance), and port-to-port isolation to ensure compliance with stringent regulatory standards and operator specifications.

Key challenges addressed included managing high PAPR signal integrity, minimising distortion across the amplification stages, and ensuring thermal stability under full-load conditions. Advanced thermal management techniques were proposed, including heatsinking and airflow optimisation, to support reliable long-term operation. The project also recommended suitable high-power RF components, filtering solutions, and PCB layout strategies to enhance system robustness, manufacturability, and field performance in demanding base station environments.

Designed a fully integrated, mechanically compact solid-state power amplifier (SSPA) for L-band applications, achieving 80W CW output power with 50 dB small-signal gain. The design included wideband input/output matching networks, a multi-stage GaN PA architecture, and >50% power-added efficiency at rated power. The compact form factor addressed stringent mechanical and thermal constraints, incorporating an advanced heatsinking solution for reliable operation under high-duty-cycle conditions

The final stage power amplifier, based on high-efficiency GaN technology, achieved a notable 55% power-added efficiency at rated output, balancing high power delivery with thermal and energy efficiency requirements. The RF budget analysis involved detailed gain distribution, noise figure optimisation, linearity assessment (including ACPR and IMD performance), and port-to-port isolation to ensure compliance with stringent regulatory standards and operator specifications.

Key challenges addressed included managing high PAPR signal integrity, minimising distortion across the amplification stages, and ensuring thermal stability under full-load conditions. Advanced thermal management techniques were proposed, including heatsinking and airflow optimisation, to support reliable long-term operation. The project also recommended suitable high-power RF components, filtering solutions, and PCB layout strategies to enhance system robustness, manufacturability, and field performance in demanding base station environments.

Developed a mechanically compact solid-state power amplifier (SSPA) for X-band wireless communication applications, delivering 10W CW output power. The design featured a multi-stage GaN amplifier chain, achieving 40–45 dB gain with >45% power-added efficiency. Advanced thermal management and low-profile mechanical construction ensured reliable operation in size-constrained, high-frequency systems.