At RFTRONICS UK Ltd, we specialize in high-performance multilayer board design review for RF, microwave, and high-speed digital systems. Whether your application requires precise impedance control, low-loss RF signal routing, or dense integration of RF and digital components, our expert team will review your designed PCB and advise to meet your board specifications.

Our services cover:

• Stack-up planning review for signal integrity, thermal management, and EMI reduction
• Controlled impedance routing review for RF and high-speed digital traces
• Power and ground plane optimization review for low-noise and high-isolation layouts
• Via strategies review (blind, buried, via-in-pad) to support compact form factors
• Design for Manufacturability review (DFM) and Design for Assembly (DFA) review best practices
• Support for materials like Rogers, Isola, and hybrid FR-4 for RF layers

We will take your board design and run a complete EM analysis using state-of-the-art analysis tools like AXIEM, COMSOL and advise you of the problem areas. We also work with leading PCB layout tools (Altium, KiCad) and collaborate with trusted PCB manufacturers to ensure seamless design-to-fabrication transitions. Whether it’s a compact IoT module, a satellite transceiver board, or a phased array feed network, RFTRONICS UK will de-risk your design and ensures performance, reliability, and scalability in every design.